V310i Optim(for Advanced Packaging and Microelectronics)
: Advanced 3D Solder
Paste Inspection (SPI)
The new 3D SPI system for advanced packaging and microelectronics is a newly launch solder paste vision platform that resolve challenging and miniature defects detection with automation & flexibility.
| System | SPI for Advanced Packaging | |
| Inspection Capabilities | Missing, XY Offset, Height, Area, Volume, Bridge and Micro Bridge. Extended Capabilities: Leadframe Inspection, Solder Bump Inspection, SiP Inspection | |
| Board Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured | |
| System Hardware | 25MP | |
| Operating System | Windows 10 (64-bit) | |
| Optical Resolution & FOV Size | 22.5mmx22.5mm @ 4.5¦Ìm telecentric lens | |
| Inspection Speed | 25MP CoaXPress @ 4.5µm Resolution: 7-15cm²/sec | |
| 3D Technologies | Phase Shift Profilometry¡¯s (PSP) Methodology | |
| Lighting Module | Multi-Segment LED Lighting | |
| Board Dimension | ||
| Maximum Board Size (L x W) | 470mmx500mm (18.5"x19.6") | |
| Minimum Board Size (L x W) | 50mmx50mm (2"x2") | |
| Maximum Board Thickness | 4mm (0.15") | |
| Minimum Board Thickness | 0.2mm (0.00787") | |
| Maximum PCB Weight | 3kg | |
| Top Clearance of PCB | 10mm | |
| Bottom clearance of PCB | 70mm | |
| PCB Edge Clearance | 3.5mm | |
| PCB Transport Height | 875mm-965mm | |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. | |
