V310i SE : Advanced 3D Solder Paste Inspection (SPI)
The best value SPI solution with AI Ultra Smart programming.
| System | V310i SE | |
| System Performances | ||
| Inspection Functions | Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. | |
| Board Level Tracebility | Camera-Read Barcodes; External Barcode Reader Configured | |
| System Hardware | 12MP | 4MP |
| Operating System | Windows 10 Pro (64 bit) | |
| Optical Resolution & FOV Size | Default: 60mmx45mm @ 15µm telecentric lens Option: 53mmx39mm @ 13µm telecentric lens Option: 32mmx24mm @ 8µm telecentric lens | Default: 40mmx40mm @ 20µm telecentric lens |
| Inspection Speed | 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec | 4MP CameraLink: 40~53cm²/sec |
| 3D Technologies | Phase Shift Profilometry¡¯s (PSP) Methodology | |
| Lighting Module | Concurrent Lighting Module | |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA | |
| PCB Dimension | SE | FDL |
| Maximum PCB Size (L x W) | 510mmx540mm (20¡±x21.2¡±) | Single Lane: 510mmx450mm (20''x17.7'') DL Equal: 510mmx250mm (20¡±x9.8¡±) |
| Minimum PCB Size (L x W) | 50mmx50mm (2¡±x2¡±) | 50mmx50mm (2¡±x2¡±) |
| Maximum PCB Inspectable Area (L x W) | 510mmx533mm (20¡±x20.9¡±) | Single Lane: 510mmx443mm (20''x17.4'') DL Equal: 510mmx243mm (20¡±x9.5¡±) |
| Maximum PCB Thickness | 4mm (0.16") | 4mm (0.16") |
| Minimum PCB Thickness | 0.5mm (0.02") | 0.5mm (0.02") |
| Maximum PCB Weight | 3kg | 3kg |
| Top Clearance of PCB | 50mm | 50mm |
| Bottom clearance of PCB | 100mm | 100mm |
| PCB Edge Clearance | 3.5mm | 3.5mm |
| PCB Transport Height | 875mm-965mm | |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. | |
| Installation Specification | ||
| Power Supplies | 100-120 V, 16A/200-240V, 8A Single Phase | |
| Air requirement | N/A | |
| System footprint (Width X Depth X Height) | 1060mmx1303mmx2000mm | |
| Total system weight | ~830kgs | |
