The MY700 printer can handle the most challenging circuit boards and components with micron accuracy, maximum speed and perfect solder joint quality. The dual-head design can be used for continuous injection of nano-upgrade minuscule points and general accumulation points, so the smallest and largest points can be handled at the same time, and the production volume is higher than before.
Easy to set up, automatic error check
The combination of state-of-the-art software and vision systems makes the MY700JP one of the most reliable solutions on the market. Set up and generate new jobs from CAD or Gerber data offline in just a few minutes. With the fastest and most accurate reference point flight identification and barcode scanning and tracking. Automatic board warping compensation, deformation compensation and advanced height measurement are used to check the cavity, flatness and buckling of the entire board. Preset parameters for challenging applications optimize solder joint volumes at speeds of up to 1 million points per hour to produce the industry's highest quality, demanding boards and components with the highest productivity.
Complete design freedom
100% software controlled, non-contact injectors can be adjusted instantly to accommodate board extensions, preferred solder joint volume and design changes.
