• Automatic solder paste printing machine for high precision
semiconductor
• Proven high speed, high precision solder paste press
• It has the characteristics of fast speed, high precision
and smooth operation platform
High speed
The basic printing cycle is 9s, the handling time is very short, and the three-track transmission system is adopted
High quality printing
The use of 4 high-precision ball screws, 3 grinding rods uniform distribution of printing pressure excellent tin ability, excellent mechanical internal structure
Cleaning system
ESE printing machine cleaning system can support Wet, Dry, Vacuum & Paperless Cleaner cleaning modes
